Precision That Defines Perfection — Setting a New Standard in Semiconductor Testing
K-SEM™ – High-Resolution Scanning Electron Microscope
Precision at the Nanoscale.
K-SEM™ is a state-of-the-art scanning electron microscope (SEM) designed for next-generation semiconductor inspection and advanced materials analysis.With a resolution capability of below 1 nanometer, K-SEM™ delivers unparalleled clarity in imaging nano-scale patterns and critical device structures.
Key Features:
< 1 nm resolution for ultra-fine surface structure analysis
Auto-alignment system for rapid setup and consistent imaging accuracy
High-magnification nano-pattern analysis, ideal for advanced semiconductor nodes
Intuitive graphical user interface (GUI) with real-time imaging feedback
Compatible with various conductive and non-conductive materials
Applications:
Semiconductor device failure analysis
Lithography pattern fidelity verification
Advanced packaging structure inspection
Nanomaterial research and cross-sectional imaging
K-RAY™ – 3D X-ray Inspection System
Reveal the Invisible — In Real Time
K-RAY™ is a high-performance 3D X-ray inspection system designed to detect internal defects in advanced semiconductor packages.With real-time imaging capabilities, K-RAY™ enables precise analysis of TSVs (Through-Silicon Vias) and micro-bump structures, ensuring structural integrity in high-density packaging.
Key Features
3D X-ray visualization of internal structures and hidden defects
Specialized for TSV and micro-bump inspection
Real-time image processing with automated measurement algorithms
High-speed scanning and high-resolution output
Supports a wide range of package types and materials
Main Applications
Internal defect analysis in semiconductor packages
TSV alignment and fill status inspection
Micro-bump and solder joint failure detection
Inspection of advanced BGA, FOWLP, and 3D IC packages
KOSCO INSIGHT AI™ – AI Defect Analysis Platform
Smarter Defect Detection. Smarter Decisions.
KOSCO INSIGHT AI™ is an advanced AI-powered analysis platform designed to transform semiconductor defect inspection with automated classification, process feedback, and root-cause prediction.By combining deep learning algorithms with real-time data visualization, it helps engineers make faster, more accurate decisions across complex production environments.
Key Features
AI-driven defect classification with high accuracy
Real-time process feedback loop for rapid quality control
Root-cause analysis engine using historical defect pattern data
Customizable dashboards with interactive defect maps and charts
Seamless integration with inspection equipment and MES systems
Main Applications
Inline defect data analysis and visualization
Pattern-based failure prediction and risk assessment
Process optimization across packaging, testing, and assembly
Data-driven yield improvement for semiconductor fabs